512M-bit NOR Flash memory with parallel interface, featuring 64-pin FBGA package for surface mount applications. This component offers 64M x 8 or 32M x 16 word organization, 25-bit address bus, and a maximum access time of 110 ns. Operating at 3.3V, it supports a programming voltage range of 3 to 3.6V and boasts symmetrical, sectored block architecture with boot block capability at the bottom or top. Designed for a temperature range of -40°C to 85°C, it has a 1 mm pin pitch and a package size of 13 x 11 mm.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Macronix MX29GA512FHXFI-11G technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
64
PCB
64
Package Length (mm)
13
Package Width (mm)
11
Package Height (mm)
0.65(Min)
Seated Plane Height (mm)
1.4(Max)
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Density
512Mbit
Interface Type
Parallel
Maximum Operating Current
100mA
Block Organization
Symmetrical
Architecture
Sectored
Programming Voltage
3 to 3.6V
Timing Type
Asynchronous
Maximum Access Time
110ns
Number of Words
64M/32M
Boot Block
Yes
Typical Operating Supply Voltage
3.3V
Address Bus Width
25bit
Location of Boot Block
Bottom|Top
Number of Bits per Word
8/16bit
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
EU RoHS
Yes
HTS Code
8542320071
Schedule B
8542320070
ECCN
3A991.b.1.a
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU
Datasheet
Macronix MX29GA512FHXFI-11G Datasheet
Download the complete datasheet for Macronix MX29GA512FHXFI-11G to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.