512M-bit NOR Flash memory with parallel interface, featuring 64-pin FBGA package for surface mount applications. This component offers 64M x 8 or 32M x 16 word organization, 25-bit address bus, and a maximum access time of 110 ns. Operating at 3.3V, it supports a programming voltage range of 3 to 3.6V and boasts symmetrical, sectored block architecture with boot block capability at the bottom or top. Designed for a temperature range of -40°C to 85°C, it has a 1 mm pin pitch and a package size of 13 x 11 mm.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Macronix MX29GA512FHXFI-11G technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 64 |
| PCB | 64 |
| Package Length (mm) | 13 |
| Package Width (mm) | 11 |
| Package Height (mm) | 0.65(Min) |
| Seated Plane Height (mm) | 1.4(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 512Mbit |
| Interface Type | Parallel |
| Maximum Operating Current | 100mA |
| Block Organization | Symmetrical |
| Architecture | Sectored |
| Programming Voltage | 3 to 3.6V |
| Timing Type | Asynchronous |
| Maximum Access Time | 110ns |
| Number of Words | 64M/32M |
| Boot Block | Yes |
| Typical Operating Supply Voltage | 3.3V |
| Address Bus Width | 25bit |
| Location of Boot Block | Bottom|Top |
| Number of Bits per Word | 8/16bit |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| EU RoHS | Yes |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | 3A991.b.1.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU |
Datasheet
Macronix MX29GA512FHXFI-11G Datasheet
Download the complete datasheet for Macronix MX29GA512FHXFI-11G to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.