128M-bit NOR Flash memory with a parallel interface, offering 16M x 8 or 8M x 16 word configurations. Features a 110ns maximum access time and operates from 2.7V to 3.6V programming voltage, with typical supply voltages of 3V or 3.3V. This surface-mount component is housed in a 56-pin TSOP-I package with gull-wing leads, measuring 14mm x 18.4mm x 1mm. It supports a 23-bit address bus, symmetrical block organization, and includes a boot block at the bottom or top. Operating temperature range is -40°C to 85°C.
PackageTSOP-I
MountingSurface Mount
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Technical Specifications
Macronix MX29GL128GDT2I-11G technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSOP-I
Package Description
Thin Small Outline Package (Type I)
Lead Shape
Gull-wing
Pin Count
56
PCB
56
Package Length (mm)
14
Package Width (mm)
18.4
Package Height (mm)
1
Mounting
Surface Mount
Density
128Mbit
Interface Type
Parallel
Maximum Operating Current
100mA
Block Organization
Symmetrical
Architecture
Sectored
Programming Voltage
2.7 to 3.6V
Timing Type
Asynchronous
Maximum Access Time
110ns
Number of Words
16M/8M
Boot Block
Yes
Typical Operating Supply Voltage
3|3.3V
Address Bus Width
23bit
Location of Boot Block
Bottom|Top
Number of Bits per Word
8/16bit
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
EU RoHS
Yes
HTS Code
8542320071
Schedule B
8542320070
ECCN
3A991.b.1.a
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU
Datasheet
Macronix MX29GL128GDT2I-11G Datasheet
Download the complete datasheet for Macronix MX29GL128GDT2I-11G to view detailed technical specifications.
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