128M-bit NOR Flash memory with a parallel interface, offering 16M x 8 or 8M x 16 word organization. Features a 110ns maximum access time and operates from 2.7V to 3.6V programming voltage, with typical supply voltages of 3V/3.3V. This surface-mount component is housed in a 64-pin LFBGA package measuring 13mm x 11mm with a 1mm pin pitch. It supports sectored architecture with symmetrical blocks, including a boot block located at the bottom or top, and operates across a -40°C to 85°C temperature range.
PackageLFBGA
MountingSurface Mount
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Technical Specifications
Macronix MX29GL128GDXFI-11G technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
LFBGA
Package Description
Low Profile Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
64
PCB
64
Package Length (mm)
13
Package Width (mm)
11
Package Height (mm)
0.65(Min)
Seated Plane Height (mm)
1.4(Max)
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Density
128Mbit
Interface Type
Parallel
Maximum Operating Current
100mA
Block Organization
Symmetrical
Architecture
Sectored
Programming Voltage
2.7 to 3.6V
Timing Type
Asynchronous
Maximum Access Time
110ns
Number of Words
16M/8M
Boot Block
Yes
Typical Operating Supply Voltage
3|3.3V
Address Bus Width
23bit
Location of Boot Block
Bottom|Top
Number of Bits per Word
8/16bit
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
EU RoHS
Yes
HTS Code
8542320071
Schedule B
8542320070
ECCN
3A991.b.1.a
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU
Datasheet
Macronix MX29GL128GDXFI-11G Datasheet
Download the complete datasheet for Macronix MX29GL128GDXFI-11G to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.