16Mbit NVSRAM, 2Mx8 organization, 8-bit parallel interface, 100ns access time. Operates at 3.3V with a 3V to 3.6V range. Features a 256-pin, 27mm x 27mm BGA package for surface mounting, with a 1.27mm pin pitch. Extended temperature range from -40°C to 85°C.
PackageBGA
MountingSurface Mount
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Technical Specifications
Maxim DS2070W-100T technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
BGA
Package Description
Plastic Ball Grid Array
Lead Shape
Ball
Pin Count
256
PCB
256
Package Length (mm)
27
Package Width (mm)
27
Package Height (mm)
7.77
Seated Plane Height (mm)
8.37
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Density
16Mbit
Type
NVSRAM
Maximum Access Time
100ns
Density in Bits
16777216bit
Maximum Operating Current
50mA
Organization
2Mx8
Data Bus Width
8bit
Interface Type
Parallel
Typical Operating Supply Voltage
3.3V
Min Operating Supply Voltage
3V
Max Operating Supply Voltage
3.6V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
1ES66
HTS Code
8542320041
Schedule B
8542320040
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Maxim DS2070W-100T Datasheet
Download the complete datasheet for Maxim DS2070W-100T to view detailed technical specifications.
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