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Technical Specifications
Maxim DS3665B+TRL technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | CSBGA |
| Package Description | Chip Scale Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 49 |
| PCB | 49 |
| Package Length (mm) | 7 |
| Package Width (mm) | 7 |
| Package Height (mm) | 1.04 |
| Seated Plane Height (mm) | 1.4 |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Category | Secure Memory with Tamper Response Hierarchy |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 1ES66 |
| EU RoHS | Yes |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Maxim DS3665B+TRL Datasheet
Download the complete datasheet for Maxim DS3665B+TRL to view detailed technical specifications.
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