PackageTQFN EP
MountingSurface Mount
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Technical Specifications
Maxim MAX13055EETI+ technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
QFN
Package/Case
TQFN EP
Package Description
Thin Quad Flat No Lead Package, Exposed Pad
Lead Shape
No Lead
Pin Count
28
PCB
28
Package Length (mm)
5.5
Package Width (mm)
3.5
Package Height (mm)
0.75
Mounting
Surface Mount
Logic Function
Voltage Level Translator
Output Type
Open Drain
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
1ES66
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Maxim MAX13055EETI+ Datasheet
Download the complete datasheet for Maxim MAX13055EETI+ to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.