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Technical Specifications
Maxim MAX3349EAEBE+ technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | UCSP |
| Package Description | Ultra Chip Scale Package |
| Lead Shape | Ball |
| Pin Count | 16 |
| PCB | 16 |
| Package Length (mm) | 2.02 |
| Package Width (mm) | 2.02 |
| Package Height (mm) | 0.33 |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Data Rate | 12Mbps |
| Number of Transceivers | 1 |
| Protocols Supported | USB 2.0 |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Typical Dual Supply Voltage | 1.8|2.5|3.3|5V |
| Minimum Dual Supply Voltage | 1.4|2.7|3|4V |
| Maximum Dual Supply Voltage | 2.75|3.3|3.6|5.5V |
| Maximum Supply Current | 2.5|6|10mA |
| Power Supply Type | Quad |
Compliance
| Cage Code | 1ES66 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | 5A991 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Maxim MAX3349EAEBE+ Datasheet
Download the complete datasheet for Maxim MAX3349EAEBE+ to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.