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Technical Specifications
Maxim MAX8893BEWV+ technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | WLP |
| Package/Case | WLP |
| Package Description | Wafer Level Package |
| Lead Shape | Ball |
| Pin Count | 30 |
| PCB | 30 |
| Package Length (mm) | 3.11(Max) |
| Package Width (mm) | 2.6(Max) |
| Package Height (mm) | 0.4 |
| Seated Plane Height (mm) | 0.64 |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Category | Power Management Integrated Circuit |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 1ES66 |
| EU RoHS | Yes |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Maxim MAX8893BEWV+ Datasheet
Download the complete datasheet for Maxim MAX8893BEWV+ to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.