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Technical Specifications
Maxim MAX8893BEWV+ technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
WLP
Package/Case
WLP
Package Description
Wafer Level Package
Lead Shape
Ball
Pin Count
30
PCB
30
Package Length (mm)
3.11(Max)
Package Width (mm)
2.6(Max)
Package Height (mm)
0.4
Seated Plane Height (mm)
0.64
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Category
Power Management Integrated Circuit
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
1ES66
EU RoHS
Yes
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Maxim MAX8893BEWV+ Datasheet
Download the complete datasheet for Maxim MAX8893BEWV+ to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.