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Technical Specifications
Maxim MAX9634WERS+ technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | UCSP |
| Package Description | Ultra Chip Scale Package |
| Lead Shape | Ball |
| Pin Count | 4 |
| PCB | 4 |
| Package Length (mm) | 1 |
| Package Width (mm) | 1 |
| Package Height (mm) | 0.4 |
| Seated Plane Height (mm) | 0.64 |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Type | Current Sense Amplifier |
| Number of Elements per Chip | 1 |
| Number of Channels per Chip | 1 |
| Maximum Input Offset Voltage | 0.25@±3.6VmV |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 1ES66 |
| EU RoHS | Yes |
| HTS Code | 8542330001 |
| Schedule B | 8542330000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Maxim MAX9634WERS+ Datasheet
Download the complete datasheet for Maxim MAX9634WERS+ to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.