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Technical Specifications
Maxim MG2580A2-376B technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
CSBGA
Package Description
Chip Scale Ball Grid Array
Lead Shape
Ball
Pin Count
376
PCB
376
Package Length (mm)
18
Package Width (mm)
18
Package Height (mm)
1.15(Max)
Seated Plane Height (mm)
1.53(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Interface Type
Serial (2-Wire, SPI)
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Compliance
Cage Code
1ES66
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Maxim MG2580A2-376B Datasheet
Download the complete datasheet for Maxim MG2580A2-376B to view detailed technical specifications.
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