PackageBGA
MountingSurface Mount
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Technical Specifications
Mercury Systems MS46H64M32L2SB-75C technical specifications.
General
Package/Case
BGA
Pin Count
152
PCB
152
Package Length (mm)
14
Package Width (mm)
14
Package Height (mm)
1.28(Max) - 0.35(Min)
Mounting
Surface Mount
Density
2Gbit
Type
Mobile LPDDR SDRAM
Organization
64Mx32
Data Bus Width
32bit
Maximum Clock Rate
133MHz
Number of Internal Banks
4
Number of Words per Bank
16M
Maximum Access Time
6.5|6ns
Density in Bits
2147483648bit
Address Bus Width
15bit
Maximum Operating Current
120mA
Typical Operating Supply Voltage
1.8V
Max Operating Supply Voltage
1.95V
Min Operating Supply Voltage
1.7V
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Compliance
Cage Code
3X893
HTS Code
8542320036
Schedule B
8542320023
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Datasheet
Mercury Systems MS46H64M32L2SB-75C Datasheet
Download the complete datasheet for Mercury Systems MS46H64M32L2SB-75C to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.