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Technical Specifications
Microchip 1N5802US/TR13 technical specifications.
General
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | MELF |
| Package/Case | A-MELF |
| Lead Shape | No Lead |
| Pin Count | 2 |
| PCB | 2 |
| Package Length (mm) | 5.08(Max) |
| Package Width (mm) | 2.62(Max) |
| Package Height (mm) | 2.62(Max) |
| Seated Plane Height (mm) | 2.62(Max) |
| Package Weight (g) | 0.539 |
| Mounting | Surface Mount |
| Type | Switching Diode |
| Configuration | Single |
| Peak Reverse Repetitive Voltage | 50V |
| Maximum Continuous Forward Current | 2.5A |
| Peak Non-Repetitive Surge Current | 35A |
| Peak Forward Voltage | 0.975V |
| Peak Reverse Current | 1uA |
| Peak Reverse Recovery Time | 25ns |
| Min Operating Temperature | -65°C |
| Max Operating Temperature | 175°C |
| Operating Junction Temperature | -65 to 175°C |
Compliance
| Cage Code | 60991 |
| EU RoHS | No |
| HTS Code | 8541100080 |
| Schedule B | 8541100080 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | Yes |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Microchip 1N5802US/TR13 Datasheet
Download the complete datasheet for Microchip 1N5802US/TR13 to view detailed technical specifications.
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