PackageE-MELF
MountingSurface Mount
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Technical Specifications
Microchip 1N6133AUS/TR13 technical specifications.
General
Package Family Name
MELF
Package/Case
E-MELF
Pin Count
2
PCB
2
Package Length (mm)
5.72(Max)
Package Width (mm)
3.76(Max)
Package Height (mm)
3.76(Max)
Mounting
Surface Mount
Direction Type
Bi-Directional
Configuration
Single
Maximum Reverse Stand-Off Voltage
98.8V
Maximum Reverse Leakage Current
1uA
Maximum Clamping Voltage
178.8V
Maximum Peak Pulse Current
2.8A
Minimum Breakdown Voltage
123.5V
Peak Pulse Power Dissipation
500W
Min Operating Temperature
-55°C
Max Operating Temperature
175°C
Operating Junction Temperature
-55 to 175°C
Number of Elements per Chip
1
Compliance
Cage Code
60991
EU RoHS
No
HTS Code
8541100080
Schedule B
8541100080
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Microchip 1N6133AUS/TR13 Datasheet
Download the complete datasheet for Microchip 1N6133AUS/TR13 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.