PackageDFN EP
MountingSurface Mount
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Technical Specifications
Microchip 25LC040AX-E/MC technical specifications.
General
Package/Case
DFN EP
Package Description
Dual Flat Package No Lead, Exposed Pad
Pin Count
8
PCB
8
Package Length (mm)
2
Package Width (mm)
3
Package Height (mm)
0.88
Mounting
Surface Mount
Density
4Kbit
Interface Type
Serial-SPI
Maximum Operating Frequency
10MHz
Maximum Access Time
50ns
Organization
512x8
Maximum Operating Current
5mA
Typical Operating Supply Voltage
3.3|5V
Density in Bits
4096bit
Data Retention
200(Min)Year
Hardware Data Protection
Yes
Max Operating Supply Voltage
5.5V
Min Operating Supply Voltage
2.5V
Min Operating Temperature
-40°C
Max Operating Temperature
125°C
Compliance
Cage Code
60991
EU RoHS
Yes
HTS Code
8542320051
Schedule B
8542320050
ECCN
EAR99
Automotive
Yes
AEC Qualified
Yes
PPAP
Yes
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Microchip 25LC040AX-E/MC Datasheet
Download the complete datasheet for Microchip 25LC040AX-E/MC to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.