64K-bit UV EPROM memory IC, organized as 8K x 8, featuring a 90ns maximum access time. This through-hole component utilizes a parallel interface and is housed in a 24-pin windowed ceramic dual in-line package (CDIP). Operating from a 4.5V to 5.5V supply, it offers in-system programmability and a maximum operating current of 90mA. The ceramic package measures 32.5mm (Max) in length, 7.87mm (Max) in width, and 3.56mm (Max) in height, with a pin pitch of 2.79mm (Max). Designed for operation between -40°C and 85°C.
PackageWindowed CDIP
MountingThrough Hole
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Technical Specifications
Microchip AT27HC642-90DI technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
DIP
Package/Case
Windowed CDIP
Package Description
Windowed Ceramic Dual In Line Package
Lead Shape
Through Hole
Pin Count
24
PCB
24
Package Length (mm)
32.5(Max)
Package Width (mm)
7.87(Max)
Package Height (mm)
3.56(Max)
Seated Plane Height (mm)
5.08(Max)
Pin Pitch (mm)
2.79(Max)
Package Material
Ceramic
Mounting
Through Hole
Density
64Kbit
Maximum Access Time
90ns
Interface Type
Parallel
Maximum Operating Current
90mA
Organization
8Kx8
Reprogramming Technique
UV
Typical Operating Supply Voltage
5V
In-System Programmability
In System|External
Density in Bits
65536bit
Max Operating Supply Voltage
5.5V
Min Operating Supply Voltage
4.5V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
60991
EU RoHS
No
HTS Code
8542320061
Schedule B
8542320060
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Microchip AT27HC642-90DI Datasheet
Download the complete datasheet for Microchip AT27HC642-90DI to view detailed technical specifications.
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