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Technical Specifications
Microchip AT80C51RD2-3CSIM technical specifications.
General
Access Time
40us
Package/Case
DIP
Core Architecture
8051
Interface
UART, USART
Lead Free
Contains Lead
Max Operating Temperature
85°C
Memory Type
ROMless,
Min Operating Temperature
-40°C
Mount
Through Hole
Number of I/Os
32
Oscillator Type
Internal
Package Quantity
9
Packaging
Rail/Tube
Peripherals
POR, PWM, WDT
RAM Size
1280B
RoHS Compliant
No
Series
80C
Compliance
RoHS
Not Compliant
Datasheet
Microchip AT80C51RD2-3CSIM Datasheet
Download the complete datasheet for Microchip AT80C51RD2-3CSIM to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.