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Technical Specifications
Microchip ATSAM3S1CB-CUR technical specifications.
General
Package/Case
TFBGA
Core Architecture
ARM
Interface
I2C, SPI, USB, UART, USART, EBI/EMI
Max Operating Temperature
85°C
Memory Size
64KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Mount
Surface Mount
Number of I/Os
79
Oscillator Type
Internal
Package Quantity
2000
Packaging
Tape and Reel
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT, DMA
Series
SAM3S
Compliance
RoHS
Compliant
Datasheet
Microchip ATSAM3S1CB-CUR Datasheet
Download the complete datasheet for Microchip ATSAM3S1CB-CUR to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.