32-bit ARM Cortex M3 RISC microcontroller featuring 512KB Flash program memory and 96KB RAM. This surface-mount device operates at a maximum clock rate of 84 MHz and supports a data bus width of 32 bits. It offers extensive peripheral interfaces including CAN, Ethernet, I2C, I2S, SPI, UART, USART, and USB. The LFBGA package is 9x9mm with a 0.8mm pin pitch, and the operating temperature range is -40°C to 85°C. Includes 16 ADC channels and 2x 12-bit DAC channels.
PackageLFBGA
MountingSurface Mount
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Technical Specifications
Microchip ATSAM3X8CA-CU technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
LFBGA
Package Description
Low Profile Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
100
PCB
100
Package Length (mm)
9
Package Width (mm)
9
Package Height (mm)
0.71
Seated Plane Height (mm)
1.1(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Family Name
SAM3X
Data Bus Width
32bit
Instruction Set Architecture
RISC
Maximum Clock Rate
84MHz
Maximum CPU Frequency
84MHz
Device Core
ARM Cortex M3
Program Memory Type
Flash
Program Memory Size
512KB
RAM Size
96KB
Number of Programmable I/Os
63
Core Architecture
ARM
Programmability
Yes
Number of Timers
1
Interface Type
CAN/Ethernet/I2C/I2S/SPI/UART/USART/USB
CAN
2
I2C
2
SPI
4
Ethernet
1
UART
4
USART
4
USB
1
I2S
1
Max Operating Supply Voltage
3.6V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
ADC Channels
16
Number of ADCs
Single
DAC Channels
2
DAC Resolution
12bit
Number of DACs
Single
Compliance
Cage Code
60991
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
3A991.a.2
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Microchip ATSAM3X8CA-CU Datasheet
Download the complete datasheet for Microchip ATSAM3X8CA-CU to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.