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Technical Specifications
Microchip DS3104GN+W technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
CSBGA
Package Description
Chip Scale Ball Grid Array
Lead Shape
Ball
Pin Count
81
PCB
81
Package Length (mm)
10
Package Width (mm)
10
Package Height (mm)
0.96
Seated Plane Height (mm)
1.4
Pin Pitch (mm)
1
Package Material
Ceramic
Mounting
Surface Mount
Compliance
Cage Code
60991
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Datasheet
Microchip DS3104GN+W Datasheet
Download the complete datasheet for Microchip DS3104GN+W to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.