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Technical Specifications
Microchip DS3104GN+W technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | CSBGA |
| Package Description | Chip Scale Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 81 |
| PCB | 81 |
| Package Length (mm) | 10 |
| Package Width (mm) | 10 |
| Package Height (mm) | 0.96 |
| Seated Plane Height (mm) | 1.4 |
| Pin Pitch (mm) | 1 |
| Package Material | Ceramic |
| Mounting | Surface Mount |
Compliance
| Cage Code | 60991 |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
Datasheet
Microchip DS3104GN+W Datasheet
Download the complete datasheet for Microchip DS3104GN+W to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.