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Technical Specifications
Microchip DSPIC33EP256GM306-E/MR technical specifications.
General
Package/Case
VQFN
Core Architecture
dsPIC
Data Bus Width
16b
Interface
I2C, SPI, IrDA, UART, USART
Max Operating Temperature
125°C
Memory Size
256KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Mount
Surface Mount
Number of I/Os
53
Oscillator Type
Internal
Package Quantity
40
Packaging
Rail/Tube
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT, DMA
RAM Size
16KB
RoHS Compliant
Yes
Series
Automotive, AEC-Q100, dsPIC™ 33EP
Compliance
RoHS
Compliant
Datasheet
Microchip DSPIC33EP256GM306-E/MR Datasheet
Download the complete datasheet for Microchip DSPIC33EP256GM306-E/MR to view detailed technical specifications.
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