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Technical Specifications
Microchip DSPIC33EP256GM310-E/BG technical specifications.
General
Package/Case
TFBGA
Core Architecture
dsPIC
Data Bus Width
16b
Frequency
60MHz
Interface
I2C, SPI, IrDA, UART, USART
Max Operating Temperature
125°C
Min Operating Temperature
-40°C
Max Supply Voltage
3.6V
Memory Size
256KB
Memory Type
FLASH,
Min Supply Voltage
3V
Mount
Surface Mount
Number of I/Os
85
Number of Timers/Counters
13
Operating Supply Voltage
3.3V
Oscillator Type
Internal
Package Quantity
184
Packaging
Tray
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT, DMA
RAM Size
32KB
RoHS Compliant
Yes
Series
Automotive, AEC-Q100, dsPIC™ 33EP
Compliance
RoHS
Compliant
Datasheet
Microchip DSPIC33EP256GM310-E/BG Datasheet
Download the complete datasheet for Microchip DSPIC33EP256GM310-E/BG to view detailed technical specifications.
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