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Technical Specifications
Microchip DSPIC33EP256GM710-H/BG technical specifications.
General
Package/Case
TFBGA
Core Architecture
dsPIC
Interface
I2C, SPI, IrDA, UART, USART
Max Operating Temperature
150°C
Memory Size
256KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Mount
Surface Mount
Number of I/Os
85
Oscillator Type
Internal
Package Quantity
184
Packaging
Tray
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT, DMA
Series
Automotive, AEC-Q100, dsPIC™ 33EP
Compliance
RoHS
Not Compliant
Datasheet
Microchip DSPIC33EP256GM710-H/BG Datasheet
Download the complete datasheet for Microchip DSPIC33EP256GM710-H/BG to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.