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Technical Specifications
Microchip HSM845G/TR13 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | DO-215-AB |
| Package/Case | SMCG |
| Package Description | SMD Plastic Package |
| Lead Shape | Gull-wing |
| Pin Count | 2 |
| PCB | 2 |
| Package Length (mm) | 7.11(Max) |
| Package Width (mm) | 6.22(Max) |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | DO-215AB |
| Type | Schottky Diode |
| Configuration | Single |
| Peak Reverse Repetitive Voltage | 45V |
| Maximum Continuous Forward Current | 8A |
| Peak Non-Repetitive Surge Current | 350A |
| Peak Forward Voltage | 0.62V |
| Peak Reverse Current | 250uA |
| Min Operating Temperature | -55°C |
| Max Operating Temperature | 175°C |
| Operating Junction Temperature | -55 to 175°C |
Compliance
| Cage Code | 60991 |
| EU RoHS | No |
| HTS Code | 8541100080 |
| Schedule B | 8541100080 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Microchip HSM845G/TR13 Datasheet
Download the complete datasheet for Microchip HSM845G/TR13 to view detailed technical specifications.
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