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Technical Specifications
Microchip LSM845G/TR13 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
DO-215-AB
Package/Case
SMCG
Package Description
SMD Plastic Package
Lead Shape
Gull-wing
Pin Count
2
PCB
2
Package Length (mm)
7.11(Max)
Package Width (mm)
6.22(Max)
Package Material
Plastic
Mounting
Surface Mount
Jedec
DO-215AB
Type
Schottky Diode
Configuration
Single
Peak Reverse Repetitive Voltage
45V
Maximum Continuous Forward Current
8A
Peak Non-Repetitive Surge Current
350A
Peak Forward Voltage
0.52V
Peak Reverse Current
2000uA
Min Operating Temperature
-55°C
Max Operating Temperature
150°C
Operating Junction Temperature
-55 to 150°C
Compliance
Cage Code
60991
EU RoHS
No
HTS Code
8541100080
Schedule B
8541100080
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Microchip LSM845G/TR13 Datasheet
Download the complete datasheet for Microchip LSM845G/TR13 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.