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Technical Specifications
Microchip LX5552LU technical specifications.
General
Package/Case
MLPQ EP
Package Description
Micro Lead Frame Package, Exposed Pad
Pin Count
16
PCB
16
Package Length (mm)
3
Package Width (mm)
3
Package Height (mm)
1(Max)
Seated Plane Height (mm)
1.05(Max)
Mounting
Surface Mount
Structure
LNA/PA
Frequency Range
2400 to 2500MHz
Typical Power Gain
26dB
Typical Noise Figure
2dB
Typical Input Power
10dBm
Typical Operating Supply Voltage
3.3V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
60991
EU RoHS
Yes
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU
Datasheet
Microchip LX5552LU Datasheet
Download the complete datasheet for Microchip LX5552LU to view detailed technical specifications.
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