PackagePDIP
Capacitance1.5(Typ)pF
MountingThrough Hole
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Technical Specifications
Microchip MAD1105E3/TU technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
DIP
Package/Case
PDIP
Package Description
Plastic Dual In Line Package
Lead Shape
Through Hole
Pin Count
14
PCB
14
Package Length (mm)
19.81(Max)
Package Width (mm)
6.73(Max)
Package Height (mm)
3.56(Max)
Package Material
Plastic
Mounting
Through Hole
Configuration
Octal
Type
Diode Array
Direction Type
Uni-Directional
Maximum Working Voltage
75V
Maximum Power Dissipation
1500mW
Maximum Leakage Current
0.2uA
Capacitance
1.5(Typ)pF
Number of Elements per Chip
8
Min Operating Temperature
-55°C
Max Operating Temperature
150°C
Compliance
Cage Code
60991
EU RoHS
Yes
HTS Code
8536308000
Schedule B
8536300000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU
Datasheet
Microchip MAD1105E3/TU Datasheet
Download the complete datasheet for Microchip MAD1105E3/TU to view detailed technical specifications.
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