PackageMDIP
Capacitance1.5(Typ)pF
MountingThrough Hole
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Technical Specifications
Microchip MAD1107e3 technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
DIP
Package/Case
MDIP
Pin Count
14
PCB
14
Package Length (mm)
19.81(Max)
Package Width (mm)
6.73(Max)
Package Height (mm)
3.56(Max)
Mounting
Through Hole
Configuration
Array 16
Type
Diode Array
Direction Type
Uni-Directional
Maximum Working Voltage
75V
Maximum Power Dissipation
1500mW
Maximum Leakage Current
0.2uA
Capacitance
1.5(Typ)pF
Number of Elements per Chip
16
Min Operating Temperature
-55°C
Max Operating Temperature
150°C
Compliance
Cage Code
60991
EU RoHS
Yes with Exemption
HTS Code
8536308000
Schedule B
8536300000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU
Datasheet
Microchip MAD1107e3 Datasheet
Download the complete datasheet for Microchip MAD1107e3 to view detailed technical specifications.
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