PackageMDIP
Capacitance1.5(Typ)pF
MountingThrough Hole
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Technical Specifications
Microchip MAD1108e3 technical specifications.
General
Package Family Name
DIP
Package/Case
MDIP
Pin Count
16
PCB
16
Package Length (mm)
19.15(Max)
Package Width (mm)
6.45(Max)
Package Height (mm)
3.4(Max)
Mounting
Through Hole
Configuration
Octal
Type
Diode Array
Direction Type
Uni-Directional
Maximum Working Voltage
75V
Maximum Power Dissipation
1500mW
Maximum Leakage Current
0.2uA
Capacitance
1.5(Typ)pF
Number of Elements per Chip
8
Min Operating Temperature
-55°C
Max Operating Temperature
150°C
Compliance
Cage Code
60991
EU RoHS
Yes
HTS Code
8536308000
Schedule B
8536300000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU
Datasheet
Microchip MAD1108e3 Datasheet
Download the complete datasheet for Microchip MAD1108e3 to view detailed technical specifications.
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