Frequency3.58MHz
PackageSOIC
MountingSurface Mount
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Technical Specifications
Microchip MT8870DS technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SOIC
Package Description
Small Outline IC
Lead Shape
Gull-wing
Pin Count
18
PCB
18
Package Length (mm)
11.75(Max)
Package Width (mm)
4.6(Max)
Package Height (mm)
2.35(Max)
Seated Plane Height (mm)
2.65(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Category
DTMF Receiver
Process Technology
CMOS
Operating Frequency
3.58MHz
Max Operating Supply Voltage
5.25V
Min Operating Supply Voltage
4.75V
Typical Supply Current
3mA
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Typical Operating Supply Voltage
5V
Compliance
Cage Code
60991
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Microchip MT8870DS Datasheet
Download the complete datasheet for Microchip MT8870DS to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.