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Technical Specifications
Microchip MT8870DS technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SOIC |
| Package Description | Small Outline IC |
| Lead Shape | Gull-wing |
| Pin Count | 18 |
| PCB | 18 |
| Package Length (mm) | 11.75(Max) |
| Package Width (mm) | 4.6(Max) |
| Package Height (mm) | 2.35(Max) |
| Seated Plane Height (mm) | 2.65(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Category | DTMF Receiver |
| Process Technology | CMOS |
| Operating Frequency | 3.58MHz |
| Max Operating Supply Voltage | 5.25V |
| Min Operating Supply Voltage | 4.75V |
| Typical Supply Current | 3mA |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Typical Operating Supply Voltage | 5V |
Compliance
| Cage Code | 60991 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Microchip MT8870DS Datasheet
Download the complete datasheet for Microchip MT8870DS to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.