PackageDIP
MountingThrough Hole
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Technical Specifications
Microchip PIC18LF25K50-E/SP technical specifications.
General
Package/Case
DIP
Core Architecture
PIC
Interface
I2C, SPI, USB, UART, USART
Max Operating Temperature
125°C
Memory Size
32KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Mount
Through Hole
Number of I/Os
22
Oscillator Type
Internal
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
RoHS Compliant
Yes
Series
PIC® XLP™ 18K
Compliance
RoHS
Compliant
Datasheet
Microchip PIC18LF25K50-E/SP Datasheet
Download the complete datasheet for Microchip PIC18LF25K50-E/SP to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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