PackageDIP
MountingThrough Hole
Quick Jump:
Technical Specifications
Microchip PIC24F08KM102-I/SP technical specifications.
General
Package/Case
DIP
Core Architecture
PIC
Interface
I2C, SPI, IrDA, UART, USART
Max Operating Temperature
85°C
Memory Size
8KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Mount
Through Hole
Number of I/Os
24
Oscillator Type
Internal
Package Quantity
15
Packaging
Rail/Tube
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT, LVD
RoHS Compliant
Yes
Series
PIC® XLP™ 24F
Compliance
RoHS
Compliant
Datasheet
Microchip PIC24F08KM102-I/SP Datasheet
Download the complete datasheet for Microchip PIC24F08KM102-I/SP to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
Product Images
