PackageDIP
MountingThrough Hole
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Technical Specifications
Microchip PIC24FV08KM101-I/P technical specifications.
General
Package/Case
DIP
Core Architecture
PIC
Interface
I2C, SPI, IrDA, UART, USART
Max Operating Temperature
85°C
Memory Size
8KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Mount
Through Hole
Number of I/Os
17
Oscillator Type
Internal
Package Quantity
22
Packaging
Rail/Tube
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT, LVD
RoHS Compliant
Yes
Series
PIC® XLP™ 24F
Compliance
RoHS
Compliant
Datasheet
Microchip PIC24FV08KM101-I/P Datasheet
Download the complete datasheet for Microchip PIC24FV08KM101-I/P to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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