The PLAD15KP110CAE3 is a single bi-directional Zener diode with a maximum reverse stand-off voltage of 110V and a maximum reverse leakage current of 10mA. It has a maximum peak pulse power dissipation of 15000W and operates over a temperature range of -55°C to 150°C. The device is mounted using surface mount technology and has a package height of 3.3mm. It is a single element per chip and is part of the PLAD package family.
PackagePLAD
MountingSurface Mount
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Technical Specifications
Microchip PLAD15KP110CAE3 technical specifications.
General
| Package Family Name | PLAD |
| Package/Case | PLAD |
| Pin Count | 2 |
| PCB | 2 |
| Package Length (mm) | 12.57 |
| Package Width (mm) | 12.57 |
| Package Height (mm) | 3.3(Max) |
| Seated Plane Height (mm) | 3.3(Max) |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Direction Type | Bi-Directional |
| Configuration | Single |
| Maximum Reverse Stand-Off Voltage | 110V |
| Maximum Reverse Leakage Current | 10uA |
| Maximum Clamping Voltage | 177V |
| Maximum Peak Pulse Current | 84A |
| Minimum Breakdown Voltage | 122V |
| Peak Pulse Power Dissipation | 15000W |
| Min Operating Temperature | -55°C |
| Max Operating Temperature | 150°C |
| Number of Elements per Chip | 1 |
Compliance
| Cage Code | 60991 |
| EU RoHS | Yes with Exemption |
| HTS Code | 8541100080 |
| Schedule B | 8541100080 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Microchip PLAD15KP110CAE3 Datasheet
Download the complete datasheet for Microchip PLAD15KP110CAE3 to view detailed technical specifications.
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