PackagePLAD
MountingSurface Mount
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Technical Specifications
Microchip PLAD15KP8.5AE3 technical specifications.
General
Package Family Name
PLAD
Package/Case
PLAD
Pin Count
2
PCB
2
Package Length (mm)
12.57
Package Width (mm)
12.57
Package Height (mm)
3.3(Max)
Seated Plane Height (mm)
3.3(Max)
Package Material
Plastic
Mounting
Surface Mount
Direction Type
Uni-Directional
Configuration
Single
Maximum Reverse Stand-Off Voltage
8.5V
Maximum Reverse Leakage Current
150uA
Maximum Clamping Voltage
14.4V
Maximum Peak Pulse Current
1041A
Minimum Breakdown Voltage
9.44V
Peak Pulse Power Dissipation
15000W
Min Operating Temperature
-55°C
Max Operating Temperature
150°C
Number of Elements per Chip
1
Compliance
Cage Code
60991
EU RoHS
Yes with Exemption
HTS Code
8541100080
Schedule B
8541100080
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Microchip PLAD15KP8.5AE3 Datasheet
Download the complete datasheet for Microchip PLAD15KP8.5AE3 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.