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Technical Specifications
Microchip PLAD30KP58CE3 technical specifications.
General
| Package Family Name | PLAD |
| Package/Case | PLAD |
| Pin Count | 2 |
| PCB | 2 |
| Package Length (mm) | 12.57 |
| Package Width (mm) | 12.57 |
| Package Height (mm) | 3.3(Max) |
| Seated Plane Height (mm) | 3.3(Max) |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Direction Type | Bi-Directional |
| Configuration | Single |
| Maximum Reverse Stand-Off Voltage | 58V |
| Maximum Reverse Leakage Current | 10uA |
| Maximum Clamping Voltage | 103V |
| Maximum Peak Pulse Current | 294A |
| Minimum Breakdown Voltage | 64.4V |
| Peak Pulse Power Dissipation | 30000W |
| Min Operating Temperature | -65°C |
| Max Operating Temperature | 150°C |
| Number of Elements per Chip | 1 |
Compliance
| Cage Code | 60991 |
| EU RoHS | Yes |
| HTS Code | 8541100080 |
| Schedule B | 8541100080 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Microchip PLAD30KP58CE3 Datasheet
Download the complete datasheet for Microchip PLAD30KP58CE3 to view detailed technical specifications.
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