PackageSMCG
MountingSurface Mount
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Technical Specifications
Microchip SMCG5630E3/TR13 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
DO-215-AB
Package/Case
SMCG
Package Description
SMD Plastic Package
Lead Shape
Gull-wing
Pin Count
2
PCB
2
Package Length (mm)
7.11(Max)
Package Width (mm)
6.22(Max)
Package Material
Plastic
Mounting
Surface Mount
Jedec
DO-215AB
Direction Type
Uni-Directional
Configuration
Single
Maximum Reverse Stand-Off Voltage
6.05V
Maximum Reverse Leakage Current
500uA
Maximum Clamping Voltage
11.7V
Maximum Peak Pulse Current
128A
Minimum Breakdown Voltage
6.75V
Peak Pulse Power Dissipation
1500W
Min Operating Temperature
-55°C
Max Operating Temperature
150°C
Number of Elements per Chip
1
Compliance
Cage Code
60991
EU RoHS
Yes
HTS Code
8541100080
Schedule B
8541100080
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU
Datasheet
Microchip SMCG5630E3/TR13 Datasheet
Download the complete datasheet for Microchip SMCG5630E3/TR13 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.