
This uni-directional diode is packaged in a SMCG lead-frame SMT package with a maximum reverse stand-off voltage of 10V and a maximum reverse leakage current of 5uA. The device can withstand a maximum clamping voltage of 18.8V and a maximum peak pulse current of 159.6mA. The peak pulse power dissipation is 3000W, and the operating temperature range is -65C to 150C.
Microchip SMLG10/TR13 technical specifications.
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | DO-215-AB |
| Package/Case | SMCG |
| Package Description | SMD Plastic Package |
| Lead Shape | Gull-wing |
| Pin Count | 2 |
| PCB | 2 |
| Package Length (mm) | 7.11(Max) |
| Package Width (mm) | 6.22(Max) |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | DO-215AB |
| Direction Type | Uni-Directional |
| Configuration | Single |
| Maximum Reverse Stand-Off Voltage | 10V |
| Maximum Reverse Leakage Current | 5uA |
| Maximum Clamping Voltage | 18.8V |
| Maximum Peak Pulse Current | 159.6A |
| Minimum Breakdown Voltage | 11.1V |
| Peak Pulse Power Dissipation | 3000W |
| Min Operating Temperature | -65°C |
| Max Operating Temperature | 150°C |
| Number of Elements per Chip | 1 |
| Cage Code | 60991 |
| EU RoHS | No |
| HTS Code | 8541100080 |
| Schedule B | 8541100080 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for Microchip SMLG10/TR13 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.