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Technical Specifications
Microchip SMLG8.5CE3/TR7 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | DO-215-AB |
| Package/Case | SMCG |
| Package Description | SMD Plastic Package |
| Lead Shape | Gull-wing |
| Pin Count | 2 |
| PCB | 2 |
| Package Length (mm) | 7.11(Max) |
| Package Width (mm) | 6.22(Max) |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | DO-215AB |
| Direction Type | Bi-Directional |
| Configuration | Single |
| Maximum Reverse Stand-Off Voltage | 8.5V |
| Maximum Reverse Leakage Current | 25uA |
| Maximum Clamping Voltage | 15.9V |
| Maximum Peak Pulse Current | 188.6A |
| Minimum Breakdown Voltage | 9.44V |
| Peak Pulse Power Dissipation | 3000W |
| Min Operating Temperature | -65°C |
| Max Operating Temperature | 150°C |
| Number of Elements per Chip | 1 |
Compliance
| Cage Code | 60991 |
| EU RoHS | Yes |
| HTS Code | 8541100080 |
| Schedule B | 8541100080 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Microchip SMLG8.5CE3/TR7 Datasheet
Download the complete datasheet for Microchip SMLG8.5CE3/TR7 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.