PackagePLCC
MountingSurface Mount
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Technical Specifications
Microchip SP8855E/IG/HPAR technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
LCC
Package/Case
PLCC
Package Description
Plastic Leaded Chip Carrier
Lead Shape
J-Lead
Pin Count
44
PCB
44
Package Length (mm)
16.66(Max)
Package Width (mm)
16.66(Max)
Package Height (mm)
3.69(Min)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-018AC
Compliance
Cage Code
60991
HTS Code
8542390001
Schedule B
8542390000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Microchip SP8855E/IG/HPAR Datasheet
Download the complete datasheet for Microchip SP8855E/IG/HPAR to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.