PackageSDIP
MountingThrough Hole
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Technical Specifications
Microchip TDA4470-MSDG technical specifications.
General
Package Family Name
DIP
Package/Case
SDIP
Package Description
Skinny Dual In Line Package
Lead Shape
Through Hole
Pin Count
28
PCB
28
Package Length (mm)
27.5(Max)
Package Width (mm)
8.7(Max)
Package Height (mm)
4.8(Max) - 0.9
Mounting
Through Hole
Compliance
Cage Code
60991
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Microchip TDA4470-MSDG Datasheet
Download the complete datasheet for Microchip TDA4470-MSDG to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.