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Technical Specifications
Microchip TVS324SM/TR13 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
MELF
Package/Case
A-MELF
Lead Shape
No Lead
Pin Count
2
PCB
2
Package Length (mm)
5.08(Max)
Package Width (mm)
2.62(Max)
Package Height (mm)
2.62(Max)
Seated Plane Height (mm)
2.62(Max)
Package Weight (g)
0.539
Mounting
Surface Mount
Configuration
Single
Maximum Reverse Stand-Off Voltage
24V
Maximum Reverse Leakage Current
1uA
Maximum Clamping Voltage
42V
Maximum Peak Pulse Current
3.6A
Minimum Breakdown Voltage
28.4V
Peak Pulse Power Dissipation
150W
Min Operating Temperature
-65°C
Max Operating Temperature
175°C
Number of Elements per Chip
1
Compliance
Cage Code
60991
EU RoHS
No
HTS Code
8541100080
Schedule B
8541100080
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Microchip TVS324SM/TR13 Datasheet
Download the complete datasheet for Microchip TVS324SM/TR13 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.