16M-bit Serial-SPI NOR Flash memory, organized as 2M x 8, features a 24-pin TBGA package with 8x6mm dimensions and 1mm pitch for surface mounting. This automotive-grade component offers synchronous operation with an 8ns maximum access time and supports dual operating voltages of 2.5V and 3.3V, with programming voltages ranging from 2.3V to 3.6V and 8.5V to 9.5V. Operating within a -40°C to 125°C temperature range, it consumes a maximum of 12mA and utilizes a sectored, symmetrical block architecture.
PackageTBGA
MountingSurface Mount
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Technical Specifications
Micron M25PX16-SOVZM3GB technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | TBGA |
| Package Description | Thin Profile Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 24 |
| PCB | 24 |
| Package Length (mm) | 8 |
| Package Width (mm) | 6 |
| Package Height (mm) | 0.8 |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 16Mbit |
| Interface Type | Serial-SPI |
| Maximum Operating Current | 12mA |
| Block Organization | Symmetrical |
| Architecture | Sectored |
| Programming Voltage | 2.3 to 3.6|8.5 to 9.5V |
| Timing Type | Synchronous |
| Maximum Access Time | 8ns |
| Number of Words | 2M |
| Boot Block | No |
| Typical Operating Supply Voltage | 2.5|3.3V |
| Address Bus Width | 1bit |
| Number of Bits per Word | 8bit |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 125°C |
Compliance
| Cage Code | 6Y440 |
| EU RoHS | Yes |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | EAR99 |
| Automotive | Yes |
| AEC Qualified | Yes |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Micron M25PX16-SOVZM3GB Datasheet
Download the complete datasheet for Micron M25PX16-SOVZM3GB to view detailed technical specifications.
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