16M-bit Serial-SPI NOR Flash memory, featuring a 2M x 8 organization and 8ns maximum access time. This surface-mount component operates with a 2.5V/3.3V typical supply voltage and supports programming voltages from 2.3V to 3.6V and 8.5V to 9.5V. Packaged in a 24-pin Thin Profile Ball Grid Array (TBGA) with 8mm x 6mm dimensions and 1mm pin pitch, it offers a maximum operating current of 12mA. Designed for automotive applications, it functions across an extended temperature range of -40°C to 125°C.
PackageTBGA
MountingSurface Mount
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Technical Specifications
Micron M25PX16-STVZM3GB technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | TBGA |
| Package Description | Thin Profile Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 24 |
| PCB | 24 |
| Package Length (mm) | 8 |
| Package Width (mm) | 6 |
| Package Height (mm) | 0.8 |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 16Mbit |
| Interface Type | Serial-SPI |
| Maximum Operating Current | 12mA |
| Block Organization | Symmetrical |
| Architecture | Sectored |
| Programming Voltage | 2.3 to 3.6|8.5 to 9.5V |
| Timing Type | Synchronous |
| Maximum Access Time | 8ns |
| Number of Words | 2M |
| Boot Block | No |
| Typical Operating Supply Voltage | 2.5|3.3V |
| Address Bus Width | 1bit |
| Number of Bits per Word | 8bit |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 125°C |
Compliance
| Cage Code | 6Y440 |
| EU RoHS | Yes |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | EAR99 |
| Automotive | Yes |
| AEC Qualified | Yes |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Micron M25PX16-STVZM3GB Datasheet
Download the complete datasheet for Micron M25PX16-STVZM3GB to view detailed technical specifications.
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