16M-bit Serial-SPI NOR Flash memory IC, featuring a 2M x 8 organization and 8ns maximum access time. This synchronous memory operates with typical supply voltages of 2.5V or 3.3V and supports programming voltages from 2.3V to 3.6V or 8.5V to 9.5V. Packaged in a 24-pin TBGA (Thin Profile Ball Grid Array) with a 1mm pin pitch, it is designed for surface mounting. The component offers a symmetrical, sectored block architecture and operates across an automotive temperature range of -40°C to 125°C.
PackageTBGA
MountingSurface Mount
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Technical Specifications
Micron M25PX16-STVZM3TGB technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | TBGA |
| Package Description | Thin Profile Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 24 |
| PCB | 24 |
| Package Length (mm) | 8 |
| Package Width (mm) | 6 |
| Package Height (mm) | 0.8 |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 16Mbit |
| Interface Type | Serial-SPI |
| Maximum Operating Current | 12mA |
| Block Organization | Symmetrical |
| Architecture | Sectored |
| Programming Voltage | 2.3 to 3.6|8.5 to 9.5V |
| Timing Type | Synchronous |
| Maximum Access Time | 8ns |
| Number of Words | 2M |
| Boot Block | No |
| Typical Operating Supply Voltage | 2.5|3.3V |
| Address Bus Width | 1bit |
| Number of Bits per Word | 8bit |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 125°C |
Compliance
| Cage Code | 6Y440 |
| EU RoHS | Yes |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | EAR99 |
| Automotive | Yes |
| AEC Qualified | Yes |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Micron M25PX16-STVZM3TGB Datasheet
Download the complete datasheet for Micron M25PX16-STVZM3TGB to view detailed technical specifications.
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