16M-bit Serial-SPI NOR Flash memory, featuring a 2M x 8 organization and 8ns maximum access time. This synchronous memory operates with typical supply voltages of 2.5V or 3.3V and supports programming voltages from 2.3V to 3.6V and 8.5V to 9.5V. Packaged in a 24-pin Thin Profile Ball Grid Array (TBGA) with a 0.8mm height and 1mm pin pitch, it is designed for surface mounting. The component offers a wide operating temperature range of -40°C to 125°C.
PackageTBGA
MountingSurface Mount
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Technical Specifications
Micron M25PX16-STVZM3TGBA technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | TBGA |
| Package Description | Thin Profile Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 24 |
| PCB | 24 |
| Package Length (mm) | 8 |
| Package Width (mm) | 6 |
| Package Height (mm) | 0.8 |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 16Mbit |
| Interface Type | Serial-SPI |
| Maximum Operating Current | 12mA |
| Block Organization | Symmetrical |
| Architecture | Sectored |
| Programming Voltage | 2.3 to 3.6|8.5 to 9.5V |
| Timing Type | Synchronous |
| Maximum Access Time | 8ns |
| Number of Words | 2M |
| Boot Block | No |
| Typical Operating Supply Voltage | 2.5|3.3V |
| Address Bus Width | 1bit |
| Number of Bits per Word | 8bit |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 125°C |
Compliance
| Cage Code | 6Y440 |
| EU RoHS | Yes |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | EAR99 |
| Automotive | Yes |
| AEC Qualified | Yes |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Micron M25PX16-STVZM3TGBA Datasheet
Download the complete datasheet for Micron M25PX16-STVZM3TGBA to view detailed technical specifications.
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