32M-bit NOR Flash memory with a parallel interface, featuring 2M words x 16 bits. This integrated circuit offers a maximum access time of 70 ns and operates from 3V or 3.3V supply voltages, with programming voltages ranging from 2.7 to 3.6V and 11.4 to 12.6V. The component is housed in a 47-pin TFBGA package with a 0.75mm pin pitch, designed for surface mounting. It includes a bottom boot block and asymmetrical sectored architecture, with a maximum operating current of 20 mA and an operating temperature range of 0°C to 70°C.
PackageTFBGA
MountingSurface Mount
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Technical Specifications
Micron M28W320BB70ZB1 technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | TFBGA |
| Package Description | Thin Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 47 |
| PCB | 47 |
| Package Length (mm) | 10.5 |
| Package Width (mm) | 6.39 |
| Package Height (mm) | 1(Max) |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 0.75 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 32Mbit |
| Interface Type | Parallel |
| Maximum Operating Current | 20mA |
| Block Organization | Asymmetrical |
| Architecture | Sectored |
| Programming Voltage | 2.7 to 3.6|11.4 to 12.6V |
| Timing Type | Asynchronous |
| Maximum Access Time | 70ns |
| Number of Words | 2M |
| Boot Block | Yes |
| Typical Operating Supply Voltage | 3|3.3V |
| Address Bus Width | 21bit |
| Location of Boot Block | Bottom |
| Number of Bits per Word | 16bit |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
Compliance
| Cage Code | 6Y440 |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | 3A991.b.1.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Micron M28W320BB70ZB1 Datasheet
Download the complete datasheet for Micron M28W320BB70ZB1 to view detailed technical specifications.
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