32M-bit NOR Flash memory with a parallel interface, featuring a 2M x 16 word organization and 70ns maximum access time. This surface-mount component utilizes a Thin Fine Pitch Ball Grid Array (TFBGA) package with 47 pins, measuring 10.5mm x 6.39mm x 1mm. It operates with typical supply voltages of 3V or 3.3V and supports programming voltages from 2.7V to 3.6V or 11.4V to 12.6V. The memory architecture is sectored with asymmetrical block organization and includes a top boot block. Operating current is a maximum of 20mA, with an operating temperature range of -40°C to 85°C.
PackageTFBGA
MountingSurface Mount
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Technical Specifications
Micron M28W320BT70ZB6T technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | TFBGA |
| Package Description | Thin Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 47 |
| PCB | 47 |
| Package Length (mm) | 10.5 |
| Package Width (mm) | 6.39 |
| Package Height (mm) | 1(Max) |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 0.75 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 32Mbit |
| Interface Type | Parallel |
| Maximum Operating Current | 20mA |
| Block Organization | Asymmetrical |
| Architecture | Sectored |
| Programming Voltage | 2.7 to 3.6|11.4 to 12.6V |
| Timing Type | Asynchronous |
| Maximum Access Time | 70ns |
| Number of Words | 2M |
| Boot Block | Yes |
| Typical Operating Supply Voltage | 3|3.3V |
| Address Bus Width | 21bit |
| Location of Boot Block | Top |
| Number of Bits per Word | 16bit |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 6Y440 |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | 3A991.b.1.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Micron M28W320BT70ZB6T Datasheet
Download the complete datasheet for Micron M28W320BT70ZB6T to view detailed technical specifications.
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