32M-bit NOR Flash memory with a parallel interface, featuring 2M x 16 words and a maximum access time of 70ns. This surface-mount component utilizes a 64-pin Thin Profile Ball Grid Array (TBGA) package with a 13mm x 10mm footprint and 0.85mm maximum height. It operates with typical supply voltages of 3V or 3.3V and supports programming voltages from 2.7V to 3.6V or 11.4V to 12.6V. The memory architecture is sectored and asymmetrical, with a boot block located at the top, and operates within a temperature range of -40°C to 85°C.
PackageTBGA
MountingSurface Mount
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Technical Specifications
Micron M28W320FST70ZA6 technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | TBGA |
| Package Description | Thin Profile Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 64 |
| PCB | 64 |
| Package Length (mm) | 13 |
| Package Width (mm) | 10 |
| Package Height (mm) | 0.85(Max) |
| Seated Plane Height (mm) | 0.85(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 32Mbit |
| Interface Type | Parallel |
| Maximum Operating Current | 18mA |
| Block Organization | Asymmetrical |
| Architecture | Sectored |
| Programming Voltage | 2.7 to 3.6|11.4 to 12.6V |
| Timing Type | Asynchronous |
| Maximum Access Time | 70ns |
| Number of Words | 2M |
| Boot Block | Yes |
| Typical Operating Supply Voltage | 3|3.3V |
| Address Bus Width | 21bit |
| Location of Boot Block | Top |
| Number of Bits per Word | 16bit |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 6Y440 |
| EU RoHS | No |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | 3A991.b.1.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Micron M28W320FST70ZA6 Datasheet
Download the complete datasheet for Micron M28W320FST70ZA6 to view detailed technical specifications.
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