64M-bit NOR Flash memory, featuring a parallel interface and 4M x 16 organization. This integrated circuit offers a maximum access time of 70 ns and operates at a typical supply voltage of 3.3V. The component is housed in a 48-pin Thin Fine Pitch Ball Grid Array (TFBGA) package with a 0.75mm pin pitch, designed for surface mounting. It supports asymmetrical block organization, sectored architecture, and includes a bottom boot block. Operating current is a maximum of 18 mA, with a wide programming voltage range.
PackageTFBGA
MountingSurface Mount
Quick Jump:
Technical Specifications
Micron M28W640ECB70ZB1 technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | TFBGA |
| Package Description | Thin Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 48 |
| PCB | 48 |
| Package Length (mm) | 10.5 |
| Package Width (mm) | 6.39 |
| Package Height (mm) | 1(Max) |
| Seated Plane Height (mm) | 1(Max) |
| Pin Pitch (mm) | 0.75 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 64Mbit |
| Interface Type | Parallel |
| Maximum Operating Current | 18mA |
| Block Organization | Asymmetrical |
| Architecture | Sectored |
| Programming Voltage | 1.65 to 3.6|11.4 to 12.6V |
| Timing Type | Asynchronous |
| Maximum Access Time | 70ns |
| Number of Words | 4M |
| Boot Block | Yes |
| Typical Operating Supply Voltage | 3.3V |
| Address Bus Width | 22bit |
| Location of Boot Block | Bottom |
| Number of Bits per Word | 16bit |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
Compliance
| Cage Code | 6Y440 |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | 3A991.b.1.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Micron M28W640ECB70ZB1 Datasheet
Download the complete datasheet for Micron M28W640ECB70ZB1 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.