32M-bit NOR Flash memory with a parallel interface, featuring 4M x 8 or 2M x 16 word organization and a maximum access time of 90ns. This component operates at 3.3V, with programming voltages ranging from 2.7-3.6V and 11.5-12.5V. It is housed in a 48-pin TSOP (Thin Small Outline Package) with gull-wing leads, designed for surface mounting. The memory architecture is sectored and asymmetrical, including a bottom boot block, and supports an address bus width of 22/21 bits. Operating temperature range is -40°C to 85°C.
PackageTSOP
MountingSurface Mount
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Technical Specifications
Micron M29DW323DB90N6E technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | TSOP |
| Package Description | Thin Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 48 |
| PCB | 48 |
| Package Length (mm) | 12 |
| Package Width (mm) | 18.4 |
| Package Height (mm) | 1 |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 32Mbit |
| Interface Type | Parallel |
| Maximum Operating Current | 10mA |
| Block Organization | Asymmetrical |
| Architecture | Sectored |
| Programming Voltage | 2.7 to 3.6|11.5 to 12.5V |
| Timing Type | Asynchronous |
| Maximum Access Time | 90ns |
| Number of Words | 4M/2M |
| Boot Block | Yes |
| Typical Operating Supply Voltage | 3.3V |
| Address Bus Width | 22/21bit |
| Location of Boot Block | Bottom |
| Number of Bits per Word | 8/16bit |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 6Y440 |
| EU RoHS | Yes |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | 3A991.b.1.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Micron M29DW323DB90N6E Datasheet
Download the complete datasheet for Micron M29DW323DB90N6E to view detailed technical specifications.
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